Chemical-mechanical planarization

Chemical-mechanical planarization (CMP) is an enabling technology in the fabrication of integrated circuits. Evonik is dedicated to being the preferred global partner for developing innovative semiconductor industry solutions for CMP.

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Global electronics-grade manufacturing

Evonik is the world's largest supplier of fumed metal oxide particles, with a proven track record in supplying the semiconductor industry abrasive particles for CMP. With electronic grade manufacturing available in all the industry growth markets, Evonik has the local resources available to develop the particle solutions you require. With over a decade of experience in supplying the CMP industry, we understand the special requirements and speak the language of our customers.

Whether your objective is to improve process yield and efficiency in an existing application, or if you are targeting slurry development for the next-generation metal CMP or node size, Evonik has the capabilities and experience necessary to supply AEROSIL® and AEROXIDE® products that satisfy the stringent requirements of semiconductor applications.

New product development

Evonik AEROSIL® and AEROXIDE® have the broadest pipeline of developmental nano-structured products available. A range of developmental fumed metal oxides, mixed metal oxides, and surface-treated metal oxides are available to assist our clients to keep pace with the International Technology Roadmap for Semiconductors (ITRS). We primarily focus our innovation on the abrasive particle. Depending on your preference these are supplied as powders or masterbatch dispersions, which can be easily converted into a CMP slurry.

Evonik as a partner

Contact us to discover how partnering a company with over 70 years of expertise in the design of nanostructured particles can benefit you.